- APO
- Polyamide
- EVA
- PU
- SBC
- Others
Asia Pacific Hot Melt Adhesives Market size was valued at USD x million in 2023 and is expected to reach USD x million by 2030, at a CAGR of x% from 2024 to 2030. Asia Pacific hot adhesives market is segmented into SBC, PU, EVA, APAO, polyamide and others. Ethylene vinyl acetate is expected to dominate the market due to increased application of hot melt adhesives in board industry, paper industry, packaging industry and others. The report studies Asia Pacific hot melt adhesives market dynamics elaborately to identify the current market trends and drivers, future opportunities and possible challenges to the key stakeholders operating in the market. In addition, Asia Pacific hot melt adhesives market report includes competition analysis with vividly illustrated the competition dashboard to assess the market competition. Moreover, PBI analyzed Asia Pacific hot melt adhesives market to better equip clients with possible investment opportunities across the country and market unmet needs (Product Opportunities).
Asia Pacific Hot Melt Adhesives Market Dynamics
Development and launch of innovative hot melt adhesives by the market players enables in the hot melt adhesives market demand over the forecast years. For instance. In 2018, Toyobo Co., Ltd. launched the new hot melt adhesives which has a wide range of application. Moreover, launch of newer products in various countries enables the growth of hot melt adhesives market over the forecast years.
Country Analysis
Asia Pacific Hot Melt Adhesives Market
Asia Pacific hot melt adhesives market report analyses the market in different countries of Asia Pacific. China accounted for major revenue share in Asia Pacific hot melt adhesives market due to increased demand of hot melt adhesives from the growing population.
Latin America
Europe
Asia Pacific
Middle East
North America
Key Features of the Reports
- The asia pacific hot melt adhesives market report provides granular level information about the market size, regional market share, historic market (2019-2023), and forecast (2024-2030).
- The report covers in-detail insights about the competitor’s overview, company share analysis, key market developments, and their key strategies.
- The report outlines drivers, restraints, unmet needs, and trends that are currently affecting the market.
- The report tracks recent innovations, key developments, and start-up details that are actively working in the market.
- The report provides a plethora of information about market entry strategies, regulatory framework, and reimbursement scenario
Asia Pacific Hot Melt Adhesives Market Segmentation
By Type
By Application
- Book Binding
- Furniture
- Non-Woven Disposables
- Packaging, Pressure Sensitive Uses
- Others
By Country
- China
- India
- Japan
- Australia
- Rest of APAC
Frequently Asked Questions
The asia pacific hot melt adhesives market key players are: Toyobo Co.Ltd., 3M Company, Sika AG, Ashland Inc., Jowat AG, Bostik S.A., Henkel AG & Company, Dow Corning, H.B. Fuller Company
The report covers the asia pacific hot melt adhesives market data: China, India, Japan, Australia & New Zealand
In our report, we provide 12-15 market players’ information into the report. However, based on the client’s request we will provide additional country and regional market players information as well.
| 1.Executive Summary |
| 2. Asia Pacific Hot Melt Adhesives Market Introduction |
| 2.1. Asia Pacific Hot Melt Adhesives Market - Taxonomy |
| 2.2. Asia Pacific Hot Melt Adhesives Market - Definitions |
| 2.2.1.Type |
| 2.2.2.Application |
| 2.2.3.Country |
| 3. Asia Pacific Hot Melt Adhesives Market Dynamics |
| 3.1. Drivers |
| 3.2. Restraints |
| 3.3. Opportunities/Unmet Needs of the Market |
| 3.4. Trends |
| 3.5. Product Landscape |
| 3.6. New Product Launches |
| 3.7. Impact of COVID 19 on Market |
| 4. Asia Pacific Hot Melt Adhesives Market Analysis, 2019-2023 and Forecast 2024-2030 |
| 4.1. Market Analysis, 2019-2023 and Forecast, 2024-2030, (Sales Value USD Million) |
| 4.2. Year-Over-Year (Y-o-Y) Growth Analysis (%) |
| 4.3. Market Opportunity Analysis |
| 5. Asia Pacific Hot Melt Adhesives Market By Type, 2019-2023 and Forecast 2024-2030 (Sales Value USD Million) |
| 5.1. APO |
| 5.1.1. Market Analysis, 2019-2023 and Forecast, 2024-2030, (Sales Value USD Million) |
| 5.1.2. Year-Over-Year (Y-o-Y) Growth Analysis (%) and Market Share Analysis (%) |
| 5.1.3. Market Opportunity Analysis |
| 5.2. Polyamide |
| 5.2.1. Market Analysis, 2019-2023 and Forecast, 2024-2030, (Sales Value USD Million) |
| 5.2.2. Year-Over-Year (Y-o-Y) Growth Analysis (%) and Market Share Analysis (%) |
| 5.2.3. Market Opportunity Analysis |
| 5.3. EVA |
| 5.3.1. Market Analysis, 2019-2023 and Forecast, 2024-2030, (Sales Value USD Million) |
| 5.3.2. Year-Over-Year (Y-o-Y) Growth Analysis (%) and Market Share Analysis (%) |
| 5.3.3. Market Opportunity Analysis |
| 5.4. PU |
| 5.4.1. Market Analysis, 2019-2023 and Forecast, 2024-2030, (Sales Value USD Million) |
| 5.4.2. Year-Over-Year (Y-o-Y) Growth Analysis (%) and Market Share Analysis (%) |
| 5.4.3. Market Opportunity Analysis |
| 5.5. SBC |
| 5.5.1. Market Analysis, 2019-2023 and Forecast, 2024-2030, (Sales Value USD Million) |
| 5.5.2. Year-Over-Year (Y-o-Y) Growth Analysis (%) and Market Share Analysis (%) |
| 5.5.3. Market Opportunity Analysis |
| 5.6. Others |
| 5.6.1. Market Analysis, 2019-2023 and Forecast, 2024-2030, (Sales Value USD Million) |
| 5.6.2. Year-Over-Year (Y-o-Y) Growth Analysis (%) and Market Share Analysis (%) |
| 5.6.3. Market Opportunity Analysis |
| 6. Asia Pacific Hot Melt Adhesives Market By Application, 2019-2023 and Forecast 2024-2030 (Sales Value USD Million) |
| 6.1. Book Binding |
| 6.1.1. Market Analysis, 2019-2023 and Forecast, 2024-2030, (Sales Value USD Million) |
| 6.1.2. Year-Over-Year (Y-o-Y) Growth Analysis (%) and Market Share Analysis (%) |
| 6.1.3. Market Opportunity Analysis |
| 6.2. Furniture |
| 6.2.1. Market Analysis, 2019-2023 and Forecast, 2024-2030, (Sales Value USD Million) |
| 6.2.2. Year-Over-Year (Y-o-Y) Growth Analysis (%) and Market Share Analysis (%) |
| 6.2.3. Market Opportunity Analysis |
| 6.3. Non-Woven Disposables |
| 6.3.1. Market Analysis, 2019-2023 and Forecast, 2024-2030, (Sales Value USD Million) |
| 6.3.2. Year-Over-Year (Y-o-Y) Growth Analysis (%) and Market Share Analysis (%) |
| 6.3.3. Market Opportunity Analysis |
| 6.4. Packaging, Pressure Sensitive Uses |
| 6.4.1. Market Analysis, 2019-2023 and Forecast, 2024-2030, (Sales Value USD Million) |
| 6.4.2. Year-Over-Year (Y-o-Y) Growth Analysis (%) and Market Share Analysis (%) |
| 6.4.3. Market Opportunity Analysis |
| 6.5. Others |
| 6.5.1. Market Analysis, 2019-2023 and Forecast, 2024-2030, (Sales Value USD Million) |
| 6.5.2. Year-Over-Year (Y-o-Y) Growth Analysis (%) and Market Share Analysis (%) |
| 6.5.3. Market Opportunity Analysis |
| 7. Asia Pacific Hot Melt Adhesives Market By Country, 2019-2023 and Forecast 2024-2030 (Sales Value USD Million) |
| 7.1. China |
| 7.1.1. Market Analysis, 2019-2023 and Forecast, 2024-2030, (Sales Value USD Million) |
| 7.1.2. Year-Over-Year (Y-o-Y) Growth Analysis (%) and Market Share Analysis (%) |
| 7.1.3. Market Opportunity Analysis |
| 7.2. India |
| 7.2.1. Market Analysis, 2019-2023 and Forecast, 2024-2030, (Sales Value USD Million) |
| 7.2.2. Year-Over-Year (Y-o-Y) Growth Analysis (%) and Market Share Analysis (%) |
| 7.2.3. Market Opportunity Analysis |
| 7.3. Australia and New Zealand (ANZ) |
| 7.3.1. Market Analysis, 2019-2023 and Forecast, 2024-2030, (Sales Value USD Million) |
| 7.3.2. Year-Over-Year (Y-o-Y) Growth Analysis (%) and Market Share Analysis (%) |
| 7.3.3. Market Opportunity Analysis |
| 7.4. Japan |
| 7.4.1. Market Analysis, 2019-2023 and Forecast, 2024-2030, (Sales Value USD Million) |
| 7.4.2. Year-Over-Year (Y-o-Y) Growth Analysis (%) and Market Share Analysis (%) |
| 7.4.3. Market Opportunity Analysis |
| 7.5. Rest of APAC |
| 7.5.1. Market Analysis, 2019-2023 and Forecast, 2024-2030, (Sales Value USD Million) |
| 7.5.2. Year-Over-Year (Y-o-Y) Growth Analysis (%) and Market Share Analysis (%) |
| 7.5.3. Market Opportunity Analysis |
| 8.China Hot Melt Adhesives Market ,2019-2023 and Forecast 2024-2030 (Sales Value USD Million) |
| 8.1. Type Analysis 2019-2023 and Forecast 2024-2030 by Sales Value USD Million, Y-o-Y Growth (%), and Market Share (%) |
| 8.1.1.APO |
| 8.1.2.Polyamide |
| 8.1.3.EVA |
| 8.1.4.PU |
| 8.1.5.SBC |
| 8.1.6.Others |
| 8.2. Application Analysis 2019-2023 and Forecast 2024-2030 by Sales Value USD Million, Y-o-Y Growth (%), and Market Share (%) |
| 8.2.1.Book Binding |
| 8.2.2.Furniture |
| 8.2.3.Non-Woven Disposables |
| 8.2.4.Packaging, Pressure Sensitive Uses |
| 8.2.5.Others |
| 9.India Hot Melt Adhesives Market ,2019-2023 and Forecast 2024-2030 (Sales Value USD Million) |
| 9.1. Type Analysis and Forecast by Sales Value USD Million, Y-o-Y Growth (%), and Market Share (%) |
| 9.1.1.APO |
| 9.1.2.Polyamide |
| 9.1.3.EVA |
| 9.1.4.PU |
| 9.1.5.SBC |
| 9.1.6.Others |
| 9.2. Application Analysis 2019-2023 and Forecast 2024-2030 by Sales Value USD Million, Y-o-Y Growth (%), and Market Share (%) |
| 9.2.1.Book Binding |
| 9.2.2.Furniture |
| 9.2.3.Non-Woven Disposables |
| 9.2.4.Packaging, Pressure Sensitive Uses |
| 9.2.5.Others |
| 10.Australia and New Zealand (ANZ) Hot Melt Adhesives Market ,2019-2023 and Forecast 2024-2030 (Sales Value USD Million) |
| 10.1. Type Analysis and Forecast by Sales Value USD Million, Y-o-Y Growth (%), and Market Share (%) |
| 10.1.1.APO |
| 10.1.2.Polyamide |
| 10.1.3.EVA |
| 10.1.4.PU |
| 10.1.5.SBC |
| 10.1.6.Others |
| 10.2. Application Analysis 2019-2023 and Forecast 2024-2030 by Sales Value USD Million, Y-o-Y Growth (%), and Market Share (%) |
| 10.2.1.Book Binding |
| 10.2.2.Furniture |
| 10.2.3.Non-Woven Disposables |
| 10.2.4.Packaging, Pressure Sensitive Uses |
| 10.2.5.Others |
| 11.Japan Hot Melt Adhesives Market ,2019-2023 and Forecast 2024-2030 (Sales Value USD Million) |
| 11.1. Type Analysis and Forecast by Sales Value USD Million, Y-o-Y Growth (%), and Market Share (%) |
| 11.1.1.APO |
| 11.1.2.Polyamide |
| 11.1.3.EVA |
| 11.1.4.PU |
| 11.1.5.SBC |
| 11.1.6.Others |
| 11.2. Application Analysis 2019-2023 and Forecast 2024-2030 by Sales Value USD Million, Y-o-Y Growth (%), and Market Share (%) |
| 11.2.1.Book Binding |
| 11.2.2.Furniture |
| 11.2.3.Non-Woven Disposables |
| 11.2.4.Packaging, Pressure Sensitive Uses |
| 11.2.5.Others |
| 12.Rest of APAC Hot Melt Adhesives Market ,2019-2023 and Forecast 2024-2030 (Sales Value USD Million) |
| 12.1. Type Analysis and Forecast by Sales Value USD Million, Y-o-Y Growth (%), and Market Share (%) |
| 12.1.1.APO |
| 12.1.2.Polyamide |
| 12.1.3.EVA |
| 12.1.4.PU |
| 12.1.5.SBC |
| 12.1.6.Others |
| 12.2. Application Analysis 2019-2023 and Forecast 2024-2030 by Sales Value USD Million, Y-o-Y Growth (%), and Market Share (%) |
| 12.2.1.Book Binding |
| 12.2.2.Furniture |
| 12.2.3.Non-Woven Disposables |
| 12.2.4.Packaging, Pressure Sensitive Uses |
| 12.2.5.Others |
| 13. Competition Landscape |
| 13.1. Market Player Profiles (Introduction, Brand/Product Sales, Financial Analysis, Product Offerings, Key Developments, Collaborations, M & A, Strategies, and SWOT Analysis) |
| 13.2.1.Toyobo Co.Ltd. |
| 13.2.2.3M Company |
| 13.2.3.Sika AG |
| 13.2.4.Ashland Inc. |
| 13.2.5.Jowat AG |
| 13.2.6.Bostik S.A. |
| 13.2.7.Henkel AG & Company |
| 13.2.8.Dow Corning |
| 13.2.9.B. Fuller Company |
| 14. Research Methodology |
| 15. Appendix and Abbreviations |
- Toyobo Co.Ltd.
- 3M Company
- Sika AG
- Ashland Inc.
- Jowat AG
- Bostik S.A.
- Henkel AG & Company
- Dow Corning
- B. Fuller Company