Thin Film Encapsulation Market: Global Market Estimation, Dynamics, Regional Share, Trends, Competitor Analysis 2016-2021 and Forecast 2022-2028

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Thin Film Encapsulation Market: By Application (Printed Circuit Board, Sensors, and Microsystems), By End-User (Medical Device Manufacturers, Aerospace, Electrical Cars, and Others), By Technology (PECVD, ALD, Inkjet Printing, VTE, and Others), and Geography

 

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Report

Description

The thin-film encapsulation market is anticipated to be valued at USD 218.8 million in 2021 and is expanded to grow at a significant CAGR of 18.7% over 2022-2028. Demand for microelectronics and consumer electronics products drives the market. The evolution of microelectronics technology, a wide range of applications for various products in the electronics industry, and applications to other sectors are expected to fuel the market. The major changes include a higher level of product integration, better product performance, reliability, and reduced costs expected to drive microelectronics demand. The encapsulation enables the expansion of the lifetime considerably. Good encapsulation relies on good-quality thin films. Widely used deposition methods are PECVD, atomic layer deposition (ALD), and parylene deposition. During the projection period, demand for semiconductor ICs is likely to be fueled by an increase in microelectronics and consumer electronics sales. The rising need for semiconductor integrated circuits is expected to boost semiconductor device manufacturers’ production capacity, which could boost market demand. In 2021, the microsystems segment accounted for a larger revenue share and was projected to grow with a CAGR of 19.2% from 2022 to 2028 to reach USD 254.3 mn by 2028.

Recent Market Developments:

In Mar 2019, Beneq has propelled new ALD coatings anti-erosion application as traditional metal oxide isn’t thin enough to ensure against fluorine. The organization is putting forth a single layer or a multilayer or blended material explicitly for improving anti-corrosive properties.

Thin Film Encapsulation Market

MARKET SUMMARY
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18.7% CAGR
  • Study Period– 2022 – 2028
  • Base Year– 2021
  • CAGR– 18.7%
  • Largest Market– North-America
  • Fastest Growing Market– Asia Pacific

Thin Film Encapsulation Market

  • The report on global thin film encapsulation market gives historical, current, and future market sizes (US$ Mn) on the basis of End-user Type, technology, application and geography.
  • The thin film encapsulation market report gives comprehensive outlook across the region with special emphasis on key regions such as North America, Europe, Asia Pacific, Latin America and Middle East and Africa.
Key Players
  • Samsung SDI
  • LG Chem
  • Universal Display Corp.
  • Applied Materials
  • Veeco Instruments
Thin Film Encapsulation Market

Dynamics

The global thin film encapsulation market has been propelled by an increase in the need for thin-film barriers in various flexible devices, a surge in the adoption rate of flexible OLED displays for smart devices, and increased capital investments in OLED technology. On the other side, a lack of technological understanding and the spread of flexible glass technology could hinder the global industry.


Asia Pacific got significant share

Thin Film Encapsulation Market

Due to the availability of several manufacturers of brands and various display panels in Japan, China, Hong Kong, South Korea, and Taiwan, APAC accounted for the largest revenue share in the global thin-film encapsulation market in 2021, with USD 116.8 Mn, and is expected to grow at a significant CAGR over the forecast years. The development of the regional market can also be linked to the advancement of the electronics and semiconductor sectors, particularly in China. Furthermore, North America accounted for a significant revenue share in the global thin-film encapsulation market over the forecast years, owing to the presence of solar cell developers.

Latin America
Latin-America
North-America
North-America
Europe
Europe
Asia Pacific
Asia-Pacific
Middle East
Middle East

Key

Features of the Report

  • The report provides granular level information about the market size, regional market share, historic market (2017-2021) and forecast (2022-2028)
  • The report covers in-detail insights about the competitor’s overview, company share analysis, key market developments, and their key strategies
  • The report outlines drivers, restraints, unmet needs, and trends that are currently affecting the market
  • The report tracks recent innovations, key developments, and start-up details that are actively working in the market
  • The report provides a plethora of information about market entry strategies, regulatory framework, and reimbursement scenario
Thin Film Encapsulation Market Segmentation


Location

GEOGRAPHY

Frequently Asked Questions

2021 is the base year and 2028 is the forecast year.

The report covers the five regions and 15+ countries market data: North America (United States, Canada), Europe (Germany, France, Italy, Spain, and United Kingdom (UK), Asia Pacific (China, India, Japan, Australia & New Zealand), Latin America (Brazil, Mexico, Argentina) and Middle East and Africa (Saudi Arabia, United Arab Emirates, South Africa).

In our report, we provide 12-15 market players’ information into the report. However, based on the client’s request we will provide additional country and regional market players information as well.


Report

Company Profile

  • Samsung SDI.
  • LG Chem.
  • Universal Display Corp. (UDC).
  • Applied Materials.
  • 3M
  • Veeco Instruments.
  • Kateeva
  • Angstrom Engineering
  • Toray Industries, Inc.
  • Meyer Burger Technology Ltd.
  • AMS Technologies AG
  • Beneq

Description

The thin-film encapsulation market is anticipated to be valued at USD 218.8 million in 2021 and is expanded to grow at a significant CAGR of 18.7% over 2022-2028. Demand for microelectronics and consumer electronics products drives the market. The evolution of microelectronics technology, a wide range of applications for various products in the electronics industry, and applications to other sectors are expected to fuel the market. The major changes include a higher level of product integration, better product performance, reliability, and reduced costs expected to drive microelectronics demand. The encapsulation enables the expansion of the lifetime considerably. Good encapsulation relies on good-quality thin films. Widely used deposition methods are PECVD, atomic layer deposition (ALD), and parylene deposition. During the projection period, demand for semiconductor ICs is likely to be fueled by an increase in microelectronics and consumer electronics sales. The rising need for semiconductor integrated circuits is expected to boost semiconductor device manufacturers’ production capacity, which could boost market demand. In 2021, the microsystems segment accounted for a larger revenue share and was projected to grow with a CAGR of 19.2% from 2022 to 2028 to reach USD 254.3 mn by 2028.

Recent Market Developments:

In Mar 2019, Beneq has propelled new ALD coatings anti-erosion application as traditional metal oxide isn’t thin enough to ensure against fluorine. The organization is putting forth a single layer or a multilayer or blended material explicitly for improving anti-corrosive properties.

ASIA PACIFIC OFFICE

Precision Business Insights, 5th Floor, Mohan’s Elite, Opp : Bharat Petroleum Pump, Khanamet Road, Hitech City, Hyderabad – 500084

EUROPE OFFICE

Precision Business Insights, Kemp House, 152 – 160 City Road, London EC1V 2NX